CMP?過濾

Chemical Mechanical Planarization(CMP) is a polishing process used to manufacture wafers for the semiconductor industry. it requires the use of a polishing tool and polishing slurry and treat wafers to be flat . Slurry filtration is a key process. The slurry particles range is 30-200um regularly, but some particle control is 0.5um. if unfiltered, scratch the wafer during polishing.

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RMF系列濾芯、PFSA系列濾芯、APS系列濾芯、囊式過濾器

 

CMP 過濾流程圖

 

如需更多資料,請聯系科百特銷售部:0571-87704266 / sales@cobetterfilter.com

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